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電子材料
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  PSPI Film及相關材料
  液態聚醯亞胺 (Polyimide Varnish)
  感光性聚醯亞胺薄光阻膜 (Photosensitive PI film)
  低介電膠
  kolon CPI
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PSPI Film及相關材料 >

Electronic materials

§ Polyimide varnish

  1. Electrical insulation and heat resistance are excellent.
  2. Excellent mechanical properties and long-term heat resistance.
  3. Insoluble in all organic solvents and acids, alkaline chemicals are resistant.
  4. Continuous operating temperature is 350 , and the instantaneous and can withstand temperatures above 400 .
  5. Redistribution Layer(RDL)

§ Epoxy resin

  1. Thermosetting Polyimide
  2. Polyimide color : Black PI / Green PI / Yellow PI

§ Silicone resin

  1. Excellent adhesion of Polyimide Film and Copper Foil, Aluminum
  2. Excellent Maintaining flexibility after curing
  3. Excellent Workability : low viscosity 

Cleaning materials

 § SA 300R : Adhesive remove cleaning liquid (Silicone & Acryl remove)

  1. Package substrate, Heat Resistant PI Tape Silicone & Acryl Adhesive Removal Solvent
  2. OCR & WLP/PLP adhesive & MLC Silicone remove solvent
  3. Solvent for removing Silicone, Acrylic
  4. Eliminates hardened siloxane and adhesive

§ PR developer & rinse

 
Process Film & Tape

§ PI film & PI tape

  1. Excellent mechanical properties and long-term heat resistance.
  2. Insoluble in all organic solvents and resistant to chemicals such as acids and alkalis.
  3. Heat resistance masking for electronic components manufacturing process
  4. High-class electrical and motor insulation and Li batteries fixation, etc.

§PI coverlay & PSPI film






  1. PI-25NF series Photosensitive Polyimide, with high reliability, excellent high-resolution, high heat resistance, and good flexibility, developed for smart phones, digital cameras and equipment's in aerospace and medical fields.
  2. PIC-2000 is negative & only film type









§
Thermal Release Tape

  1. TRA-150SH is used as a component of the mobile device.
  2. Easy and simple rework
  3. Excellent temperature change restoring force
  4. Strong adherends to various adherends.
  5. Excellent resilience properties.
  6. Employing polyester release film with less dust generation and plastic core.
  7. Using transparent PET carrier, transparent adhesive.
  8. Adhesion under 10gf/25mm (Release after  150 heating, 10min)

§ Release PET, ETFE & PTFE

§ Cushion Pad, Silicone Pad & PET Rubber



  1.  PTS film is non sticky and has non-slip.
  2. Non-Slip Process film & Hot Press Cushion pad
  3. MLCC, Chip and Package PCB, Glass alignment
  4. Excellent mechanical properties and long-term heat resistance.
  5. Insoluble in all organic solvents and resistant to chemicals such as acids and alkalis.
  6. Heat resistance masking for electronic components manufacturing process
 
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